In an apparatus for performing an electrical inspection, a first substrate has a first surface and a second surface opposite to the first surface, and an electrical contact section is disposed on the first surface of the first substrate. A signal line is disposed within the first substrate to electrically connect the first surface with the second surface. The electrical contact section is electrically connected with the signal line and has elasticity so as to become curved when the electrical contact section is brought into contact with an object to be inspected. An electrical connection section is electrically connected with the second surface of the first substrate and has a micro-strip line structure that comprises a first conductive layer serving as a transmission line, a second conductive layer serving as a ground line and a dielectric layer disposed between the first and second conductive layers.
