| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of forming a resist pattern, which can obtain a desired resist pattern profile. <P>SOLUTION: The method includes: a process of forming a resist film on a substrate to be processed; a baking process of causing a temperature gradient in a thickness direction of the resist film to make the temperature higher on the bottom of the resist film on a side of the substrate to be processed than on the upper surface of the resist film; a process of exposing the resist film; and a process of developing the resist film. <P>COPYRIGHT: (C)2009,JPO&INPIT |
