| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit component mounting structure that excellently absorbs thermal stress based upon the difference in coefficient of linear expansion between a printed circuit board and a bus bar. <P>SOLUTION: The bus bar 3A is fixed onto the board with an insulating sheet interposed, and a resin mold IC is joined to the bus bar 3A. The bus bar 3A has a parallel main portion 31 extending in an X direction and a bent end portion 32 bent from the tip of the parallel main portion 31 to reach the printed circuit board 6 and having its tip soldered to the printed circuit board 6. The bent end portion 32 has a first bend portion whose thickness direction matches the X direction, i.e. the length direction of the parallel main portion 31 of the bus bar 3A and a second bend portion whose thickness direction matches a Y direction, i.e. the width direction of the parallel main portion 31 of the bus bar 3A. Consequently, the thermal stress based upon the difference in coefficient of linear expansion between the printed circuit board and bus bar can excellently be absorbed, thereby improving the temperature cycle life of a soldering portion between the printed circuit board 6 and bus bar 3. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
