| 摘要 |
A package (16) for electrically connecting one or more integrated circuits (12) to a printed circuit board (14) includes a substrate body (16A), a pinout (16B), and a support assembly (18). The substrate body (16A) includes at least one insulating layer (222), and at least one patterned conductive layer (220) that is electrically connected to the integrated circuit (12) and the printed circuit board (14). The pinout (16B) extends between the substrate body (16A) and the printed circuit board (14), and the pinout (16B) electrically and mechanically connects the substrate body (16A) to the printed circuit board (14). The support assembly (18) includes at least one support (38) that extends between the substrate body (16A) and the printed circuit board (14) to support the substrate body (16A) relative to the printed circuit board (14). The support (38) includes a passive electrical component (19) that is electrically connected to the at least one patterned conductive layer (220). As a result thereof, the support (38) inhibits thermal and/or mechanical shock and cycles from causing mechanical instability an interface of the package (16) and the printed circuit board (14). Further, because the passive electrical components (19) are integrated into the support (38), valuable space in the printed circuit board (16A) is saved.
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