| 摘要 |
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system (106) capable of engaging a processor (104) and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system (600, 700, 800, 900) including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principle (600, 700). |
