DISH HAVING IC TAG AND ITS MOLDING METHOD

摘要

PROBLEM TO BE SOLVED: To safely attach an IC tag to a dish body by using strength of thermosetting resin for protection of the IC tag that is attached to a dish made of the thermosetting resin.

SOLUTION: The dish is formed of the thermosetting resin by compression molding. The dish includes a dish body 1 having an outer wall part 2 and an inner wall part 3, and the IC tag 6 embedded between the outer wall part 2 and the inner wall part 3. The IC tag 6 is fixedly arranged in a holding function part 4 formed on a joined surface between the outer wall part 2 and the inner wall part 3. The IC tag 6 is embedded and positioned accurately so that the IC tag 6 is effectively protected by the strength of the thermosetting resin.

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