| 摘要 |
A substrate processing apparatus and a method for treating substrates are provided to prevent the destruction of micro-pattern by removing readily the deionized water between micro-patterns. A substrate processing apparatus comprises a process bath(1), a supporting mechanism(7), the first feeding unit, the second feeding unit, the third feeding unit, and a control unit(97). The process bath accommodates the processing liquid and the substrate. The first feeding unit supplies the deionized water to the process bath. The second feeding unit supplies the water-soluble organic solvent to the process bath. The third feeding unit supplies the non-aqueous organic solvent to the process bath. A control unit applies processing liquids to the top of the substrate by driving the process bath, the supporting mechanism, the first feeding unit, the second feeding unit, and the third feeding unit.
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