发明名称 |
Method and Apparatus for Cleaning Semiconductor Wafers Using Compressed and/or Pressurized Foams, Bubbles, and/or Liquids |
摘要 |
An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.
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申请公布号 |
US2009078282(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
US20080240300 |
申请日期 |
2008.09.29 |
申请人 |
LAM RESEARCH CORPORATION |
发明人 |
DE LARIOS JOHN M.;RAVKIN MIKE;FARBER JEFFREY;KOROLIK MIKHAIL;REDEKER FRITZ;OWCZARZ ALEKSANDER |
分类号 |
B08B1/00;B08B3/00;H01L21/00 |
主分类号 |
B08B1/00 |
代理机构 |
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