发明名称 |
HIGH OUTPUT POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSMITTING AND RECEIVING DEVICE, AND HIGH OUTPUT POWER AMPLIFIER MOUNTING METHOD |
摘要 |
<p>It is an object to provide a high output power amplifier, a wireless transmitter and a high output power amplifier mounting method that are high in heat dissipation effect and low in cost. A high output power amplifier is comprised of a transistor with a lead wire extending from both side surfaces of a mold set on a heat radiation member to the outside, a bifacial wiring board that has an aperture where the heat radiation member is inserted and a wiring pattern on its one surface where the lead wire is electrically connected, and a case that receives the bifacial wiring board, wherein the high output power amplifier is further provided with a plate, one main surface of which is in contact with the inner wall of the case while the other main surface of which is connected with the heat radiation member and a wiring pattern of the other main surface of the bifacial wiring board.</p> |
申请公布号 |
WO2009037995(A1) |
申请公布日期 |
2009.03.26 |
申请号 |
WO2008JP66262 |
申请日期 |
2008.09.09 |
申请人 |
NEC CORPORATION;ISHINO, TOORU |
发明人 |
ISHINO, TOORU |
分类号 |
H03F3/24;H03F1/30;H03F3/193;H03F3/60;H05K1/18 |
主分类号 |
H03F3/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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