| 摘要 |
PROBLEM TO BE SOLVED: To secure mechanical connection between a semiconductor chip and a substrate while preventing the generation of a short circuit caused by a bump portion protruded from a concavity of the substrate without previously providing the bump and a conductive adhesive in the concavity of the substrate in an electronic apparatus constituted by providing en electrode in the concavity formed on one surface of a substrate, introducing the bump of the semiconductor chip into the concavity, and connecting the bump with a substrate electrode. SOLUTION: In an electronic apparatus, a concavity 21 whose bottom is constituted by a substrate electrode 40 is provided on one surface 20a of a substrate 20, a bump 30 is introduced into the concavity 21 and made to come into direct contact with the substrate electrode 40, an electric insulative adhesive 50 is arranged on a portion other than the concavity 21 of a portion between the substrate 20 and a semiconductor chip 10, the semiconductor chip 10 and the substrate 20 are adhered to each other, and a nonadhesive arrangement portion 60 which is a region in which the adhesive 50 is not arranged on an opening edge of the concavity 21 and a region for housing a protruded portion from the concavity 21 of the bump 30 is provided between the substrate 20 and the semiconductor chip 10. COPYRIGHT: (C)2009,JPO&INPIT
|
