| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment in which a silicon die is prevented from being damaged. SOLUTION: A portable computer 1 is constituted of its body 2, a printed circuit board 15 stored in the body 2, and a cooling unit. The printed circuit board 15 is mounted with a semiconductor package 16, having a substrate 31 and the rectangular silicon die 32 mounted on the substrate 31. The cooling unit has a heat-receiving plate 24, which is thermally connected to the silicon die 32 and receives heat from the semiconductor package 16. The heat-receiving plate 24 includes a contact portion 24a that is opposed to the silicon die 32 and the heat-receiving plate body portion 24b in contact with the contact portion 24a, with the contact portion 24a being larger in rigidity than the heat-receiving plate body portion 24b. COPYRIGHT: (C)2009,JPO&INPIT
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