A method for manufacturing a substrate is provided to facilitate the extraction of a circuit laminate by using a supporter including an oxide metal layer. A supporter includes a base material and a first metal layer. The base material is made of the metal. A first metal layer is formed in one side of the base material(S210). The whole or a part of the first metal layer is oxidized. A first metal oxide layer is formed(S220). A second metal layer is formed in one side of the first oxide metal layer(S230). A circuit laminate is formed in one side of the second metal layer(S240). The first oxide metal layer and the second metal layer are separated. The circuit laminate is separated from the supporter(S250). The second metal layer is selectively etched to the predetermined shape(S260). The solder resist layer is formed in one side of the circuit laminate(S270).
申请公布号
KR20090030970(A)
申请公布日期
2009.03.25
申请号
KR20070096710
申请日期
2007.09.21
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
JEONG, SUNG WON;AN, JIN YONG;JEONG, KWANG OK;NAM, HYO SEUNG;JUNG, SOON OH;SHIM, DA MI