发明名称 |
Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage |
摘要 |
A positioning stage that can prevent an excessive force from being imparted to a positioned wafer, a bump forming apparatus equipped with such a positioning stage, and a bump forming method performed using such a positioning stage are provided. A biasing member that biases a wafer towards a positioning member has a contact surface that substantially faces a wafer-holding surface at an angle. The contact surface is in contact with an outer peripheral area of the wafer so as to bias the wafer slantwise towards the wafer-holding surface. With a resiliently deformable member, the positioning member is brought into contact with the wafer and is held at a predetermined position. When a bias force exceeding a predetermined magnitude is imparted to the positioning member, the resiliently deformable member becomes resiliently deformed so as to allow the positioning member to recede from the predetermined position.
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申请公布号 |
US7508495(B2) |
申请公布日期 |
2009.03.24 |
申请号 |
US20070942320 |
申请日期 |
2007.11.19 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
ADACHI NAOYA;SUMITA MASAYUKI;SEKINO MASAKI |
分类号 |
G03B27/58;G03B27/62 |
主分类号 |
G03B27/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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