| 摘要 |
PROBLEM TO BE SOLVED: To enhance heat transfer from a heat generating electronic component to a shield case, thus improving the function of the shield case as a heat sink. SOLUTION: A shield case 1 is prepared on a printed-circuit board 2, crowned portions 8 and 9 are formed in sections corresponding to heat generating parts 3 and 4 mounted onto the circuit-circuit board of the shield case, concave grooves 11 are formed around the crowned portions, and apexes of the heat generating components are engaged into the crowned portions. COPYRIGHT: (C)2009,JPO&INPIT
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