发明名称 |
FIN-TYPE HEAT SINK FOR ELECTRONIC COMPONENT |
摘要 |
One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body.
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申请公布号 |
US2009065175(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
US20080205773 |
申请日期 |
2008.09.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BANG HYO-JAE;KIM JUNG-HYEON |
分类号 |
F28F7/00 |
主分类号 |
F28F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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