发明名称 Method and structure for textured thermal cut for photovoltaic applications for thin films
摘要 A photovoltaic device and related methods of manufacture. The device has a support substrate having a support surface region. The device has a thickness of crystalline material overlying the support surface region of the support substrate. Preferably, the thickness of material has an upper surface region. The device has a glue layer provided between the support surface region and the thickness of material according to a specific embodiment. In a preferred embodiment, the device has a textured surface region formed overlying from the upper surface region of the thickness of crystalline material. Depending upon the embodiment, the device has a plurality of elevated regions having a first thickness defining a first portion of the textured surface region and a plurality of recessed regions having a second thickness defining a second portion of the textured surface region.
申请公布号 US2009065050(A1) 申请公布日期 2009.03.12
申请号 US20080204590 申请日期 2008.09.04
申请人 SILICON CHINA (HK) LIMITED 发明人 CHEUNG NATHAN W.;WONG MAN
分类号 H01L31/00;H01L21/00 主分类号 H01L31/00
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