发明名称 |
CONDENSER MICROPHONE USING THE CERAMIC PACKAGE WHOSE INSIDE IS ENCOMPASSED BY METAL OR CONDUCTIVE MATERIALS |
摘要 |
<p>Provided is a condenser microphone. The condenser microphone includes: a substrate disposed on a micro electro mechanical system (MEMS) microphone chip and a circuit part; a package having a ring shape and disposed on the substrate, the package surrounding the MEMS microphone chip and the circuit part; an insertion part having a ring shape and formed of a conductive material, the insertion part being attached to an inner wall of the package; and an upper plate completely covering the package, the upper plate having an acoustic hole through which sound passes. In addition, the condenser microphone includes: a substrate disposed on a MEMS microphone chip and a circuit part; a package disposed on the substrate and covering the MEMS microphone chip and the circuit part, the package having an acoustic hole through which sound passes; and an insertion part attached to an inner wall of the package, the insertion part being formed of a conductive material.</p> |
申请公布号 |
WO2009031742(A1) |
申请公布日期 |
2009.03.12 |
申请号 |
WO2008KR01866 |
申请日期 |
2008.04.03 |
申请人 |
BSE CO., LTD.;PARK, SUNG-HO;CHOO, YUN-JAI |
发明人 |
PARK, SUNG-HO;CHOO, YUN-JAI |
分类号 |
H04R19/04 |
主分类号 |
H04R19/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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