发明名称 Adhesion promoter
摘要 The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate. Moreover, the present invention refers to a method of making a metal coated article comprising: providing a substrate; contacting a surface of said substrate with a solution comprising a Bi metal ion, and applying a metal coating on said activated surface of said substrate. Furthermore an article obtainable by any of said methods, is claimed.
申请公布号 US2009068362(A1) 申请公布日期 2009.03.12
申请号 US20060919904 申请日期 2006.03.29
申请人 VALSPAR SOURCING, INC. 发明人 BAHLS HARRY J.
分类号 C03C17/40;B05D3/10 主分类号 C03C17/40
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