发明名称 |
Method and apparatus for detecting substrate temperature in a track lithography tool |
摘要 |
The temperature of a wafer is measured using thermal sensors that are embedded in elastomeric diaphragms positioned in holes formed in a support layer of a bake plate. A pressure differential caused by heating the bake plate causes the elastomeric diaphragms to contact the wafer. The thermal sensors determine the temperature of the wafer at the locations where the elastomeric diaphragms contact the wafer.
|
申请公布号 |
US7500781(B1) |
申请公布日期 |
2009.03.10 |
申请号 |
US20070924433 |
申请日期 |
2007.10.25 |
申请人 |
SOKUDO CO., LTD. |
发明人 |
HERCHEN HARALD |
分类号 |
G01K1/14;G01K7/16;H05B3/68 |
主分类号 |
G01K1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|