| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion device and an imaging system in which a substrate bias can be supplied from a top surface of a semiconductor substrate to a semiconductor region on the reverse surface side of the semiconductor substrate. SOLUTION: The photoelectric conversion device 1 includes the semiconductor substrate having a pixel region 130 and a peripheral region 131 disposed at a periphery of the pixel region, a power source line for supplying the substrate bias, and a contact plug 150 disposed in the peripheral region and connecting the semiconductor substrate to the power source line, wherein in the semiconductor substrate, the substrate bias is supplied from the power source line to the semiconductor region through the contact plug. COPYRIGHT: (C)2009,JPO&INPIT
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