| 摘要 |
<P>PROBLEM TO BE SOLVED: To pick up accurately a miniaturized chip. <P>SOLUTION: A method for mounting electronic-components used when so interlocking the chip present in a wafer-state with the thrusting-up of a needle 17a of an ejector 15 as to suck the chip by a sucking nozzle 8 of a move-mounting head 7 and as to move and mount the chip on a substrate has a step for so sucking by the sucking nozzle 8 a nozzle-position detecting jig 20 to whose top surface a nozzle mark 20a indicating the position of the sucking nozzle 8 is attached as to mount the jig 20 on a wafer-position, and has a step for imaging by a recognizing camera 24 moved by the interlocking with the ejector 15 such a head reference mark 22 provided in a position above the move-mounting head 7 which has the distance nearly equal to the distance between the move-mounting head 7 and the end of the needle 17a as to indicate the position of the move-mounting head 7, and further, has a step for imaging by the recognizing camera 24 after the evacuation of the move-mounting head 7 the nozzle mark 20a present on the nozzle-position detecting jig 20 and left in the wafer-position, and moreover, has a step for seeking the discrepancy between the head reference mark 22 and the nozzle mark 20a, and furthermore, has a step so controlling by considering the discrepancy the position of the ejector 15 that the center of the chip and the center of the sucking nozzle 8 and the center of the needle 17a consist with each other. <P>COPYRIGHT: (C)2009,JPO&INPIT |
