发明名称 |
CERAMIC CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A ceramic circuit board and a manufacturing method thereof are disclosed. The method includes the steps of providing a first pre-mold plate and a first ceramic thin plate, stacking the first ceramic thin plate and the first pre-mold plate, and co-firing the first ceramic thin plate and the first pre-mold plate to commonly form the ceramic circuit board.
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申请公布号 |
US2009053487(A1) |
申请公布日期 |
2009.02.26 |
申请号 |
US20080027888 |
申请日期 |
2008.02.07 |
申请人 |
WEI CHIH-HUNG;HSIEH YU PING |
发明人 |
WEI CHIH-HUNG;HSIEH YU PING |
分类号 |
G03F7/00;B05D5/12;B32B3/00 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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