| 摘要 |
PROBLEM TO BE SOLVED: To facilitate shrinkage and reduction in size of contacts and achieve a low-profile and low-impedance IC socket, thereby advantageously corresponding to improvement of the high-frequency characteristics of an IC. SOLUTION: The IC socket has an upper base substrate 17 and a lower base substrate 18 placed at a concave portion 16 for accommodating an IC, a first contact slot 19 and a second contact slot 20 provided on these base substrates respectively, a contact 13 comprising a first contact section 13a for mounting and contacting an IC lead, a second contact section 13b coming in contact with a circuit wiring 24, a coupled section 13c connecting from the first contact section 13a to the second contact section 13b and a pressurization section 13d provided in a protruding form behind the coupled section 13c, and an elastic body housing section 27 for housing an integrally structured elastic body 14 with many contacts 13 embedded. The IC socket is structured in such a manner that the contact pressure among the contact, IC lead and wiring is obtained by a restoring force generated when the pressurization section 13d compresses the elastic body 14. COPYRIGHT: (C)2009,JPO&INPIT
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