| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device with which a circuit capable of precisely detecting chip crackings can be securely achieved without reference to restrictions of a design rule. <P>SOLUTION: The semiconductor device comprises: a plurality of semiconductor wiring patterns PW which have first and second connection terminals and are formed electrically separated from a semiconductor substrate; a plurality of electrode patterns PE which are each ohmic-connected to a first connection terminal Ca of one semiconductor wiring pattern PW and ohmic-connected to a second connection terminal Cb of another semiconductor wiring pattern PW to electrically connect the two semiconductor wiring patterns PW to each other; and a pair of inspection pads PD which are each configured to be connected to a first or second connection terminal of a semiconductor wiring pattern PW and arranged in proximity to each other, wherein a series of inspection pattern groups GP constituted by alternately connecting the semiconductor wiring patterns PW and electrode patterns PE including the pair of inspection pads PD as a start point and an end point are arranged along an outer edge portion of the semiconductor substrate except the part between the pair of inspection pads PD. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
