发明名称 Thermoplastic Films For Insulated Metal Substrates And Methods Of Manufacture Thereof
摘要 An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of less than or equal to 0.050 Kelvin-square inches per watt, and a breakdown voltage greater than or equal to 1000 volts (alternating current), and an electrically conductive layer disposed upon the dielectric layer.
申请公布号 US2009050355(A1) 申请公布日期 2009.02.26
申请号 US20080195939 申请日期 2008.08.21
申请人 WORLD PROPERTIES, INC. 发明人 CHUN SEUNG B.
分类号 H05K1/09;B32B27/38;H05K3/30 主分类号 H05K1/09
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