| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure a uniform underfill resin region even if a gap between an electronic component and a substrate becomes different since the electronic component becomes large in an electronic apparatus constituted by solder-connecting the electronic component onto one surface of the substrate and filling a portion between the electronic component and the substrate with underfill resin. <P>SOLUTION: On the outer periphery of a region, on which an electronic component 20 is mounted, of one surface 10a of a substrate 10, a dam 50 which projects from the one surface 10a is arranged in such a manner that the region is surrounded by the dam. Underfill resin 40 is housed in the inner periphery of the dam 50. A wettability deteriorated portion 51 having smaller wettability to the underfill resin 40 than that of the front surface other than a portion with which solder 30 is connected in the electronic component 20 is provided on the front surface of the dam 50. <P>COPYRIGHT: (C)2009,JPO&INPIT |
