| 摘要 |
<p>An embedded electronic device (1) and a method for manufacturing the same wherein the embedded electronic device (1) is composed of a printed circuit board (10), having a top surface (11) and a bottom surface (12), a plurality of circuit components (20) attached to the top surface (11) of the printed circuit board (10) having a plurality of standoffs (13) on the bottom surface (12) of the printed circuit board (10), a bottom overlay (30) attached to the bottom surface of the printed circuit board (10), a top overlay (40) positioned above the top surface of the printed circuit board (10) and a core layer (50) positioned between the top surface (11) of the printed circuit board (10) and the top overlay (40).</p> |
