发明名称 |
SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device is composed of a pair of semiconductor chips (402, 404) arranged parallel on the same flat plane; a high voltage bus bar (21) bonded on the surface on the collector side of one semiconductor chip (402); a low voltage bus bar (23) connected to the surface on the emitter side of the other semiconductor chip (404) with a bonding wire (27); a first metal wiring board (24-1) connected to the surface on the emitter side of the semiconductor chip (402) with a bonding wire (26); a second metal wiring board (24-2) bonded on the surface on the collector side of the semiconductor chip (404); a third metal wiring board (24-3) connected to the first metal wiring board (24-1); a fourth metal wiring board (24-4) connected by being bent from an end portion of the second metal wiring board (24-2); and an output bus bar (24) having output terminals (405) extending from each end portion of the third metal wiring board (24-3) and that of the fourth metal wiring board (24-4). |
申请公布号 |
EP2028692(A1) |
申请公布日期 |
2009.02.25 |
申请号 |
EP20070743997 |
申请日期 |
2007.05.17 |
申请人 |
HONDA MOTOR CO., LTD. |
发明人 |
TAKANO, FUMITOMO;WATANABE, SHINYA;AIBA, TSUKASA;OTSUKA, HIROSHI;NAKASHIMA, JOJI |
分类号 |
H01L25/07;H01L23/495;H01L25/18 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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