发明名称 SUBSTRATE WITH JOINING FILM, JOINING METHOD AND JOINED PRODUCT
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate with a joining film which can be strongly and efficiently joined to an adherend in high dimensional accuracy, to provide a method for efficiently joining the joining film-having substrate to the adherend at low temperature, and to provide a joined product in which the joining film-having substrate and the adherend are strongly joined to each other in high dimensional accuracy and having high reliability. <P>SOLUTION: This substrate with a joining film has a substrate 2 and a joining film 3 disposed on the substrate 2, and can be joined to a facing substrate 4 (other adherend). The joining film 3 is a film containing Si skeletons having random atom structures containing siloxane (Si-O) bonds, and releasing groups bonded to the Si skeletons, and the crystallinity of the Si skeletons is &le;45%. The joining films 3 is irradiated with UV rays to release the releasing groups from Si skeletons, whereby adhesiveness to the facing substrate 4 can be expressed to the surface 35 of the joining film 3. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009035721(A) 申请公布日期 2009.02.19
申请号 JP20080133673 申请日期 2008.05.21
申请人 SEIKO EPSON CORP 发明人 MATSUO YASUHIDE;OTSUKA KENJI;HIGUCHI KAZUHISA;WAKAMATSU KOSUKE
分类号 C09J7/02;B41J2/16;C09J5/02;C09J183/04;C09J183/05;H01L21/02;H01L27/12 主分类号 C09J7/02
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