| 摘要 |
THERE IS DISCLOSED A FLIP-CHIP-TYPE METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES. THE PROPOSED INVENTION OFFER ONE STEP ENCAPSULATION PROCESS TO PROMOTE ADHESION OF DIE TO THE LEAD FINGER AND PREVENT THE POTENTIAL OF SHORTS FROM DEVELOPING BETWEEN THE ADJACENT BUMPS (6) OR LEAD FINGERS. CONVENTIONAL MOLD COMPOUND IS USED TO REDUCE LOCALIZED STRESS CAUSES CAUSES BY COEFFICIENT OF THERMAL EXPANSION (CTE) MISMATCH BETWEEN THE DIE (7) AND SUBSTRATE, OR THE LEAD FRAME (5). THIS IS PARTICULARLY FAVORABLE IN PROMOTING GREATER MECHANICAL ROBUSTNESS OF THE SENICONDUCTOR DEVICES. WITH ONE STEP ENCAPSULATION PROCESS PROPOSED BY THE PRESENT INVETNION, MANUFACTURING PROCESS IS MADE SIMPLER, FASTER AND RELATIVELY CHEAPER.
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