发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE PROVIDED WITH ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To prevent the occurrence of an unavailable state caused by moisture inside an air gap and an increase in noise in an electronic component. <P>SOLUTION: The electronic component 1 includes a fixed film 8, a vibration film 16 facing the fixed film 8, a first electrode 6 provided on the fixed film 8 and having at least one first through-hole 11 in the center part, a second electrode 18 provided at a position on the vibration film 16 so as to be overlapped with the first electrode 6 and having at least one second through-hole 17 at the peripheral edge part, an air gap 14 composed so as to be surrounded by a rib 10 between the fixed film 8 and the vibration film 16 and communicating with the first through-hole 11 and the second through-hole 17 respectively, and at least one side-hole 15 extending from the air gap 14 toward the outside while being provided in the rib 10 surrounding the air gap 14. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009038732(A) 申请公布日期 2009.02.19
申请号 JP20070203085 申请日期 2007.08.03
申请人 PANASONIC CORP 发明人 NANO MASANORI;TOMITA YOSHIHIRO;FUKUDA TOSHIYUKI
分类号 H04R19/01;H04R19/04 主分类号 H04R19/01
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