| 摘要 |
An LED package is provided to display the various color to outside without the loss of the light by using encapsulating material for scattering the light. The heat sink slug(20) which suppresses performance and lifetime lowering of the LED chip by promoting the heat dissipation of the LED chip(2) is inserted into the housing(10). The LED chip is adhered to the protrusion of the heat dissipation slug. The LED package(1) comprises the first and second lead frames(32,34) for applying current in the LED chip. The first and the second lead frame are electrically connected to the LED chip by the bonding wire(W). In the opening of the housing, the light-transmissive encapsulating material(40) is formed in order to protect the LED chip.
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