Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate

摘要

The method involves providing connection of a thin conducting wire (1) and a substrate surface (4) by utilizing surface energy of a connecting material melted by a heat supply, where the connecting material coats the wire and the substrate surface. The wire is fixed up for hardening the connecting material by utilizing electrostatic pressing force on a substrate, where the connecting material is hot-melt glue. Electrostatic pressing force is produced when the conducting wire and electrodes (29, 51) are arranged under the substrate. An independent claim is also included for a device for installing a thin wire on a surface of a substrate.