| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, capable of preventing chip crack as much as possible in the manufacturing process. <P>SOLUTION: The method includes steps of: preparing a substrate body having an inside surface forming the inner side surface of the device and an outside surface forming the outer side surface of the device, both the surfaces being mutually opposed; forming, at least on the outside surface of the substrate body, an outside wiring pattern having a non-external terminal pattern covered with an insulating material and an external terminal pattern electrically connectable to the outside, which are mutually electrically connected, by use of a conductive material; covering the non-external terminal pattern of the outside wiring pattern with an insulating film; forming a metal plating layer on the external terminal pattern of the outside wiring pattern to reduce a difference in level from the insulating film or eliminate the difference in level; mounting a semiconductor chip on the inside surface of the substrate body; and molding the inside surface of the substrate body together with the semiconductor chip by a mold resin. <P>COPYRIGHT: (C)2009,JPO&INPIT |
