EXPOSURE EQUIPMENT, EXPOSURE METHOD, AND MANUFACTURING METHOD FOR A SEMICONDUCTOR DEVICE

摘要

Provided is an exposure equipment having high resolution even when a reticle is inclined. The exposure equipment includes: an optical system for projecting on a wafer (130), a pattern formed on a surface of a reticle (101); a determining section for determining a tilt angle of the reticle (101) with respect to a plane perpendicular to an optical axis direction of the optical system; and an adjusting section for adjusting a position of the wafer (130) based on the tilt angle determined by the determining section.