| 摘要 |
PROBLEM TO BE SOLVED: To eliminate such troubles as defects in wafer on its handling, particle adhesion, contamination and the like when the wafers are inspected and analyzed on the quality of their backsides, and further to reduce time and labor required for the inspection and the analysis on the back of the wafer. SOLUTION: The upper part of FOUP 11 has the same configuration as that of the bottom of FOUP to be installed and fitted to the production equipment of a semiconductor. The wafer can be made inside out only by setting the FOUP 11 upside down because the FOUP 11 is symmetrically structured up and down, when the wafer is required to set inside out during its processing step. COPYRIGHT: (C)2009,JPO&INPIT |
