| 摘要 |
A semiconductor integrated circuit includes a main memory cell array, redundancy memory cell array, memory macro and repair information transferring circuit. A repair information analyzing circuit fetches repair information of transferred unit repair information therein, outputs the repair information to the memory macro having a redundancy repair mechanism and subjects the memory macro to a redundancy repair process by the redundancy repair mechanism of the memory macro in a case where memory identification information of the transferred unit repair information coincides with memory identification information stored in a nonvolatile memory element.
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