发明名称 |
PAD CONDITIONER OF SEMICONDUCTOR WAFER POLISHING APPARATUS AND MANUFACTURING METHOD THEREOF |
摘要 |
A pad conditioner of semiconductor wafer polishing apparatus and a pad conditioner manufacturing method thereof are provided with a uniform conditioning for a polishing pad of a polishing apparatus, the polishing apparatus being for evenly planarizing a metal layer formed on the surface of wafer in a semiconductor device manufacturing processor. The pad conditioner may include a substrate constructed of a flat plate of disk shape, a coating part formed with a given thickness on the substrate, and a plurality of protrusion parts formed on the coating part, the plurality of protrusion parts having a plurality of polishing members based on the same size in a predetermined grouping or pattern.
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申请公布号 |
US2009042494(A1) |
申请公布日期 |
2009.02.12 |
申请号 |
US20080187007 |
申请日期 |
2008.08.06 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MOON SUNG-TAEK;KANG KYOUNG-MOON;AHN BONG-SU;KIM NAM-SOO;HONG GI-SIK |
分类号 |
B24B53/00;B24B53/02;B24D18/00;C25D9/04 |
主分类号 |
B24B53/00 |
代理机构 |
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代理人 |
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