发明名称 Verfahren zum Herstellen von plaettchenfoermigen Halbleiterkoerpern von Halbleiterbauelementen aus einem Halbleitereinkristall
摘要 852,003. Semi-conductor devices. SIEMENS EDISON SWAN Ltd. May 22, 1959 [June 10, 1958], No. 18536/58. Class 37 A slice of monocrystalline germanium or other semi-conductor is separated into sections by scribing lines on the slice and then etching with an etchant which preferentially attacks the strained regions of the semi-conductor. The etchant may consist of equal proportions of hydrogen peroxide and potassium hydroxide, and used at 70‹ to 80‹C. The scribing may be performed by means of a diamond probe, and a plurality of slices may be processed simultaneously. Fig. 2 shows a pattern of scribed lines on a crystal, and Fig. 3 the position after etching has taken place.
申请公布号 DE1142420(B) 申请公布日期 1963.01.17
申请号 DE1959S063377 申请日期 1959.06.09
申请人 ASSOCIATED ELECTRICAL INDUSTRIES (WOOLWICH) LIMITED 发明人 FREESTONE ROLAND;WEIR MARY TERESA
分类号 B28D5/00;C23F1/02;C30B33/00;H01L21/00;H01L21/301;H01L21/304 主分类号 B28D5/00
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