发明名称 Heat sink and laser diode
摘要 <p>The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel (3) caused by galvanic corrosion. A heat sink (1A) in which a water channel (3) of a cooling fluid is formed by stacking and bonding a plurality of thin plates (21-25), in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates. </p>
申请公布号 EP2003749(A3) 申请公布日期 2009.02.11
申请号 EP20080009643 申请日期 2008.05.27
申请人 SONY CORPORATION 发明人 SASAKI, KENJI;KAWANISHI, HIDEKAZU;HAMAGUCHI, YUICHI
分类号 H01S5/024 主分类号 H01S5/024
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