| 摘要 |
An integrated circuit package system with multiple devices is provided to reduce manufacturing cost and improve reliability and yield, so decreasing the footprint of the printed circuit board. In an integrated circuit package system with multiple devices, an outer side interconnection unit(218) is positioned adjacent to the die attach pedal(210). The inner side interconnection unit(220) is extended than the outer side interconnection unit to the die attach pedal. In the integrated circuit device(208) is on the die attach pedal, it is connected to the inner side interconnection unit and outer side interconnection unit. The package encapsulant(102) is positioned on the integrated circuit device and the die attach paddle. The outside interconnection unit(104) is adhered to the lower part of the outer side interconnection unit. A circuit device(106) is extended over the opposite side of the die attach pedal to the traverse direction and it is positioned at lower part of the die attach pedal. |
