POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, RESIN FILM MADE FROM POSITIVE PHOTOSENSITIVE RESIN COMPOSITION THEREOF, FPC MANUFACTURING METHOD AND FPC

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition used for forming a protective film of FPC (flexible printed circuit), wherein the composition is excellent in development property and plating-proof property and with which a protective film restraining the occurrence of wrinkles when pressing (adhering) a reinforcing plate in manufacturing of the FPC and damages when performing solder reflow or correction by hand soldering can be formed.

SOLUTION: The positive photosensitive resin composition contains a solvent-soluble heat-resistant resin, a positive-acting photosensitizer, a heat-curing agent, and a solvent. The heat-curing agent is a melamine-type curing agent, and the solvent-soluble heat-resistant resin contains polyimide or polyamide containing diamine having a hydroxyl group in its building block. The resin film is manufactured using the composition. In the manufacturing method of the FPC, the composition is used. The FPC is obtained with the method.

COPYRIGHT: (C)2009,JPO&INPIT