| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a semiconductor device which can mitigate a thermal stress for not disconnecting a wiring, a manufacturing method thereof, a circuit board packaging these, and an electronic apparatus having this circuit board. <P>SOLUTION: The semiconductor device 10 has a semiconductor chip 12; a solder ball 20 for connecting to the outside; a wiring 18 for electrically connecting the semiconductor chip 12 to the solder ball 20; a stress-relaxing layer 16 formed on the semiconductor chip 12; and a stress-transmitting part 22 for transmitting stress from the solder ball 20 to the stress-relaxing layer 16, at an outer peripheral position of an electrical connecting part 24a of the solder ball 20 and the wiring 18. <P>COPYRIGHT: (C)2009,JPO&INPIT |
