| 摘要 |
A slurry injection system of the chemical mechanical polishing is provided to improve the abrasion efficiency of wafer by distributing uniformly the slurry according to the abrasive face. The slurry injection system of the chemical mechanical polishing comprises the slurry delivery arm(40) having the slurry spray nozzle, the drive material(50) rotating the slurry delivery arm at the fixed angle, the controller(70) controlling the drive unit and the operation member(80) transmitting the control mode to the controller. The slurry delivery arm is comprised of the body(41) and the arm(42) and the top cover. The operation member controls the polishing process mode of different rotation angle of the slurry delivery arm and the check mode of the polishing pad.
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