发明名称 |
DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND METHODS OF MANUFACTURE |
摘要 |
An integrated power device module having a leadframe structure with first and second spaced pads and one or more common source-drain leads located between said first and second pads, first and second transistors flip chip attached respectively to said first and second pads, wherein the source of said second transistor is electrically connected to said one or more common source-drain leads, and a first clip attached to the drain of said first transistor and electrically connected to said one or more common source-drain leads. In another embodiment a partially encapsulated power quad flat no-lead package having an exposed top thermal drain clip which is substantially perpendicular to said with a folded stud exposed top thermal drain clip, and an exposed thermal source pad. |
申请公布号 |
WO2009017999(A2) |
申请公布日期 |
2009.02.05 |
申请号 |
WO2008US70611 |
申请日期 |
2008.07.21 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION;NOQUIL, JONATHAN A.;MADRID, RUBEN |
发明人 |
NOQUIL, JONATHAN A.;MADRID, RUBEN |
分类号 |
H01L23/42 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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