| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus having a reduced space and a substrate treatment method, capable of uniformly treating a surface to be treated of a substrate with a treatment liquid and excellently drying the substrate while preventing incomplete drying. SOLUTION: The substrate is held upright and opposite members are put closer to both surfaces thereof and disposed at first proximity positions (steps ST1 and ST2). Wet treatments using chemical liquids A to C and a rinse liquid are carried out in this state one after another (steps ST3 to ST6). Then, the opposite members are moved to second proximity positions while IPA steam is supplied (steps ST7 and ST8). The intervals between the substrate and the opposite members in a second proximity position are larger than that in a first proximity position. Consequently, flows of remaining treatment liquids staying between the substrate and opposite members are promoted. Then, nitrogen gas is blown to dry the substrate (step ST9). COPYRIGHT: (C)2009,JPO&INPIT
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