| 摘要 |
PROBLEM TO BE SOLVED: To form a reliable adhesion portion while a simple tape etc., is used as a support substrate for temporarily supporting a protection cap made of polyimide when the protection cap is bonded to a semiconductor substrate. SOLUTION: This manufacturing method includes the steps of: preparing a semiconductor substrate 3 having a structure 2 formed on its surface; bonding thermosetting polyimide 7 to the support substrate 6 with a thermally peelable adhesive 8; forming a cavity 9 on the surface of the polyimide 7; coating the surface of the thermosetting polyimide 7 with a photosensitive polyimide precursor 11 and performing exposure and development; and temporarily sticking the thermosetting polyimide 11 on the surface of the semiconductor substrate 11, where the -COOH/maximum peak detection intensity ratio of the photosensitive polyimide precursor 11 is made >0.15 in the step wherein the photosensitive polymide precursor 11 is applied and the exposure and development are carried out. COPYRIGHT: (C)2009,JPO&INPIT
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