SINGLE WAFER LEVEL DEVICE PACKAGE AND METHOD OF PACKAGING THE SAME

摘要

A single wafer level device package and a packaging method thereof are provided to omit use of separate electrode pad by performing an electric connection through a conductive pattern of a sealing line. A single wafer level device package comprises a substrate(10'), a sealing line(40), and a wiring(30). A device(20) is positioned on a bottom surface of the substrate. The wiring is formed on the bottom surface of the substrate. The sealing line surrounds the device in order to seal the device, and has at least two conductive patterns(42) and a non-conductive pattern(41). The package is mounted using the sealing line. The non-conductive pattern is made of one selected among BCB(Benzocyclobutene), DFR(Dry Film Resin), epoxy, and thermosetting polymer. The conductive pattern is made of metal or conductive paste.