SEMICONDUCTOR PACAKGE AND METHOD OF MANUFACTURING THEREOF

摘要

A semiconductor package and a manufacturing method thereof are provided to shorten the number of manufacturing processes by simplifying the process for forming the rewiring pattern. The first insulating layer pattern(20) having the opening which covers a semiconductor chip(1) and exposes a bonding pad(5) is formed. A rewiring pattern(30) including conductivity polymer is arranged on the first insulating layer pattern and is electrically contacted with the bonding pad. The second insulating layer pattern(40) covering the first insulating layer pattern has the opening for exposing a part of the rewiring pattern.