METHOD FOR FORMING SIDE WIRINGS

摘要

A method for forming side wirings is provided to realize the semiconductor device of the high capacity and integration by transferring a conductive paste containing the conductive particle in the side of the laminate laminating a plurality of semiconductor. A method for forming side wirings is comprised of steps: laminating a plurality of semiconductor devices and forming a laminate; forming a side wiring on the side of the laminate and connecting the semiconductor device electrically; making at least a part of the wiring of which end is connected to the electrode terminal of the semiconductor device extended or exposed to the outside; transferring the conductive paste(36) containing the conductive particle adhered through the predetermined length of the imprint wire(transferring wire)(30) to the side of laminate and the side wiring.